The CSI International Symposium on Real-Time and Embedded Systems and Technologies (RTEST)
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The IEEE-sponsored RTEST symposium aims at bringing researchers in the fields of real-time and embedded systems and related research areas, from both industry and academia together. This event was held as national only event from 1995 to 2014. Starting from 2015 (see this link), RTEST became a successful international symposium and 2018 edition accepts only submissions in English. RTEST 2018 will be held on May 9-10, 2018 at the University of Tehran (College of Engineering), Tehran, Iran.
RTEST 2018 welcomes submissions in all theoretical and application-oriented areas, reporting design, analysis, implementation, evaluation, and empirical results, of real-time and embedded systems, Internet-of-Things, and Cyber-Physical Systems, including (but not limited to): real-time software and applications, embedded hardware, multicore and manycore embedded systems, networked/distributed real-time/embedded systems, real-time control systems, real-time and embedded operating systems, hardware/software co-design, system-level design, modeling and verification, real-time scheduling and resource management, quality-of-service (QoS) management, power and thermal management, compilers for embedded systems, WCET estimation, testing and debugging of embedded and real-time systems, dependable real-time systems, and security.

Example application areas include (but not limited to): Oil, gas, and petrochemical industries, robotics, avionics, smart home, and autonomous driving.

Selected papers will be invited to submit an extended version of their contribution to a special issue of one of the following journals for possible publication after another round of review:
* Elsevier Microprocessors and Microsystems
(Special Section on Design for Resilience in Cyber-Physical Systems)

* Scientia Iranica journal (Transactions on Computer Science & Engineering and Electrical Engineering-
* JCSE (

The accepted and presented papers will be considered to be published in IEEE Xplore.